Huawei has introduced a wide variety of high-end Smartphone in the world market. To showcase high performance, improved battery life and to reduce the heating issue of Smartphone, the Huawei has introduced their new high-end octa-core mobile chipset- Kirin 950on Honor’s latest product Honor 8.
Key Specifications of Kirin 950
· It is integrated with the octa-core processor.
· CPU- 4x ARM Cortex-A72 cores (2.3GHz) + 4x ARM Cortex-A53 cores (1.8 GHz)
· Fabrication process- 16nm FinFET plus process technology
· Graphics Processor- ARM Mali-T880 GPU
Importance of 16nm FinFET Plus process technology in Kirin 950 SoC
Kirin 950 is in-house with TSMC’s 16nm (16 nm or 16 nanometers is the size of the transistor fin used in the chipset) FinFET plus process technology, an enhanced version of FinFET technology.
The efficiency and battery life of the device can be improved by reducing the size of the transistor in the chipset. When the size of the transistor reduced in the chip, it is possible to fix more transistor fins in the same space. The tightly packed transistor fin increases the flow of current, thus improves the energy efficiency.
Compared to 28nm/ 22nm SoC, the size of the transistor fin in the 16nm SoC is smaller and the transistors are tightly packed. The slimmer 16nm SoC consumes less power than other processors and it bring performance benefits and prolong battery life. When compared with the 28nm process which is used in Snapdragon 616 processor, the 16nm FinFET plus process technology improves the performance by 65% and reduces power consumption by 70%. Thus the Kirin 950 makes new breakthroughs in devices with prolonging battery life.
Benefits of 16nm FinFET plus process technology
· Showcase high performance
· It improves the speed and the
· Reduces the heating issue
· Improves battery life